Business Wire

Furukawa Electric Begins Mass Producing Stealth Dicing Tape

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
Business Wire

Fonon Corporation Highlights its Wafer Dicing System for Semiconductor Industry Applications

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
AZOM

Wafer analysis of laser grooving

Advances in laser grooving means that manufacturers are able to optimize die separation quality by combining traditional blade dicing and laser grooving techniques to separate individual chips from ...
The Financial

Panasonic and Tokyo Seimitsu Start Taking Orders for Their Jointly Developed Laser Patterning Machine for Plasma Dicing

The FINANCIAL — Panasonic Corporation, and Tokyo Seimitsu Co., Ltd. (hereinafter Tokyo Seimitsu) on March 12 announced that Tokyo Seimitsu and Panasonic’s subsidiary’s company, Panasonic Smart Factory ...
Semiconductor Engineering

Inspecting IC Packages Using Die Sorters

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...